300mm Silicon Wafer

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seat: Zhejiang
Validity to: Long-term effective
Last update: 2024-02-11 22:44
Browse the number: 471
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Product Description

 

This wafer has a diameter of 300 millimeters, making it larger than traditional wafer sizes. This larger size makes it more cost-effective and efficient, allowing for greater production output without sacrificing quality.

 

The 300mm silicon wafer is made from extremely pure silicon, ensuring excellent performance and reliability in a wide range of applications. It offers high precision and uniformity, ensuring consistent performance and quality in every batch.

 

In terms of mechanical properties, this wafer has excellent flatness and thickness uniformity, resulting in a high yield and low defect rate during production. Its surface is extremely smooth, making it ideal for high-performance applications that require optimum surface quality.

 

Another advantage of the 300mm silicon wafer is its ability to withstand high temperatures, making it suitable for use in a variety of harsh environments. This feature is particularly beneficial for industries such as aerospace and defense, where components must perform reliably in extreme conditions.

 

Overall, the 300mm silicon wafer is a top-of-the-line product that offers unparalleled performance and reliability. Its advanced features and benefits make it an essential component in many industries, providing high-quality substrates for a wide range of devices and systems.

 

Growth

CZ, MCZ, FZ

Grade

Prime, Test, Dummy, etc.

Diameter

12 inch / 300mm

Thickness

600~800um

Finish

As cut, lapped, DSP (300nm, 200nm, 120nm, 90nm, 65nm, 37nm), etc.

Orientation

(100) etc.

Off cut

Up to 4 deg

Type/Dopant

P/B, N/Phos, N/As, N/Sb, Intrinsic

Resistivity

CZ/MCZ: From 0.001 to 200 ohm-cm

FZ: Up to 5000 ohm-cm

Thin films

* PVD: Al, Cu, Au, Cr, Si, Ni, Fe, Mo. etc, Coating thicknesses up to 20, 000 Å / ± 5 %

* LPCVD/PECVD: Oxide, Nitride, SiC, etc , Coating thicknesses up to 200, 000 Å / ± 3 %

* Silicon epitaxial wafers and epitaxial services (SOS, GaN, GOI etc).

Processes

DSP, ultra thin, ultra flat, etc.

Downsizing, back grinding, dicing, etc.

MEMS

 

Product Picture

http://www.sibranchwafer.com/

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